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Voltage Detector IC Series
Free Delay Time Setting CMOS Voltage Detector IC Series
BD52G, BD52FVE, BD53G, BD53FVE series
No.09006EBT03
Description ROHM's BD52G/FVE and BD53G/FVE series are highly accurate, low current consumption reset IC series with a built-in delay circuit. The lineup was established with tow output types (Nch open drain and CMOS output) and detection voltages range from 2.3V to 6.0V in increments of 0.1V, so that the series may be selected according the application at hand. Features 1) Detection voltage: 2.3V to 6.0V (Typ.), 0.1V steps 2) High accuracy detection voltage: 1.0% 3) Ultra-low current consumption: 0.8A (Typ.) 4) Nch open drain output (BD52G/FVE), CMOS output (BD53G/FVE) 5) Compact packages VSOF5: BD52FVE, BD53FVE SSOP5: BD52G, BD53G Applications All electronic devices that use micro controllers and logic circuits Selection Guide No.
1
Specifications Output Circuit Format Detection Voltage Package
Description 2:Open Drain Output, 3:CMOS Output
Example: Displays VS over a 2.3V to 6.0V range in 0.1V increments.
Part Number : BD5
1 2 3
2 3
G:SSOP5 / FVE:VSOF5
Lineup
Marking PW PV PU PT PS PR PQ PP PN PM PL PK PJ PH PG PF PE PD PC Detection Voltage 6.0V 5.9V 5.8V 5.7V 5.6V 5.5V 5.4V 5.3V 5.2V 5.1V 5.0V 4.9V 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V Part Number BD5260 BD5259 BD5258 BD5257 BD5256 BD5255 BD5254 BD5253 BD5252 BD5251 BD5250 BD5249 BD5248 BD5247 BD5246 BD5245 BD5244 BD5243 BD5242 Marking PB PA MV MU MT MS MR MQ MP MN MM ML MK MJ MH MG MF ME MD Detection Voltage 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V Part Number BD5241 BD5240 BD5239 BD5238 BD5237 BD5236 BD5235 BD5234 BD5233 BD5232 BD5231 BD5230 BD5229 BD5228 BD5227 BD5226 BD5225 BD5224 BD5223 Marking RW RV RU RT RS RR RQ RP RN RM RL RK RJ RH RG RF RE RD RC Detection Voltage 6.0V 5.9V 5.8V 5.7V 5.6V 5.5V 5.4V 5.3V 5.2V 5.1V 5.0V 4.9V 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V Part Number BD5360 BD5359 BD5358 BD5357 BD5356 BD5355 BD5354 BD5353 BD5352 BD5351 BD5350 BD5349 BD5348 BD5347 BD5346 BD5345 BD5344 BD5343 BD5342 Marking RB RA QV QU QT QS QR QQ QP QN QM QL QK QJ QH QG QF QE QD Detection Voltage 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V Part Number BD5341 BD5340 BD5339 BD5338 BD5337 BD5336 BD5335 BD5334 BD5333 BD5332 BD5331 BD5330 BD5329 BD5328 BD5327 BD5326 BD5325 BD5324 BD5323
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1/9
2009.06 - Rev.B
BD52G, BD52FVE, BD53G, BD53FVE series
Absolute maximum ratings (Ta=25C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output *1*3 SSOP5 Power *2*3 Dissipation VSOF5 Operating Temperature Ambient Storage Temperature
Technical Note
Symbol VDD-GND VOUT Pd Topr Tstg
Limits -0.3 ~ +10 GND-0.3 ~ +10 GND-0.3 ~ VDD+0.3 540 210 -40 ~ +105 -55 ~ +125
Unit V V mW C C
*1 Use above Ta=25C results in a 5.4mW loss per degree. *2 Use above Ta=25C results in a 2.1mW loss per degree. *3 When a ROHM standard circuit board (70mmx70mmx1.6mm glass epoxy board) is mounted.
Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105C) Parameter Detection Voltage Symbol VDET Condition VDD=HL, RL=470k VDET =2.3-3.1V VDET =3.2-4.2V VDD=VDET-0.2V VDET =4.3-5.2V VDET =5.3-6.0V VDET =2.3-3.1V VDET =3.2-4.2V VDD=VDET+2.0V VDET =4.3-5.2V VDET =5.3-6.0V VOL0.4V, Ta=25~105C, RL=470k VOL0.4V, Ta=-40~25C, RL=470k VDS=0.5V VDD=1.2V VDS=0.5V VDD=2.4V VDS=0.5V VDD=4.8V VDET=2.3-4.2V VDS=0.5V VDD=6.0V VDET=4.3-5.2V VDS=0.5V VDD=8.0V VDET=5.3-6.0V VDD=VDS=10V VDD=VDETx1.1, VDET=2.3-2.6V, RL=470k VDD=VDETx1.1, VDET=2.7-4.2V, RL=470k CT pin Threshold Voltage VCTH VDD=VDETx1.1, VDET=4.3-5.2V, RL=470k VDD=VDETx1.1, VDET=5.3-6.0V, RL=470k Output Delay Resistance CT pin Output Current Detection Voltage Temperature coefficient Hysteresis Voltage RCT ICT VDD=VDETx1.1 VCT=0.5V VCT=0.1V VDD=0.95V VCT=0.5V VDD=1.5V
*1 *1 *1
Circuit Current when ON
IDD1
Circuit Current when OFF
IDD2
Operating Voltage Range `Low' Output Current (Nch)
VOPL IOL
`High' Output Current (Pch) Leak Current when OFF
IOH Ileak
*1
Min. Max. VDET(T) VDET(T) VDET(T) x0.99 x1.01 0.80 2.40 0.85 2.55 0.90 2.70 0.95 2.85 0.75 2.25 0.80 2.40 0.85 2.55 0.90 2.70 0.95 1.20 0.4 1.2 2.0 5.0 0.7 1.4 0.9 1.8 1.1 2.2 0.1 VDD VDD VDD x0.30 x0.40 x0.60 VDD VDD VDD x0.30 x0.45 x0.60 VDD VDD VDD x0.35 x0.50 x0.60 VDD VDD VDD x0.40 x0.50 x0.60 5.5 9 12.5 15 40 150 240 VDET x0.03 100 VDET x0.05 360 VDET x0.08
Limit Typ.
Unit V
A
A
V mA
mA A
V
M A ppm/C V
VDET/T Ta=-40C to 105C VS VDD=LHL, RL=470k
VS(T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. Designed Guarantee. (Outgoing inspection is not done on all products.) *1 Guarantee is Ta=25C.
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2/9
2009.06 - Rev.B
BD52G, BD52FVE, BD53G, BD53FVE series
Block Diagrams BD52G/FVE
VDD
Technical Note
BD53G/FVE
VDD
VOUT VOUT
Vref
Vref
GND
CT
GND
CT
Fig.1
TOP VIEW
Fig.2
TOP VIEW
SSOP5 PIN No. 1 2 3 4 5 Symbol VOUT VDD GND N.C. CT Function Reset Output Power Supply Voltage GND Unconnected Terminal
Capacitor connection terminal for output delay time
VSOF5 PIN No. 1 2 3 4 5 Symbol VOUT SUB CT GND VDD Function Reset Output Substrate*
Capacitor connection terminal for output delay time
GND Power Supply Voltage
*Connect the substrate to GND.
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3/9
2009.06 - Rev.B
BD52G, BD52FVE, BD53G, BD53FVE series
Reference Data (Unless specified otherwise, Ta=25C)
Technical Note
"LOW" OUTPUT CURRENT IOL [mA]
CIRCUIT CURRENT IDD [A]
BD5242G/FVE 1.5
BD5242G/FVE 15 12 9 6 3 0 0.0 VDD=1.2V VDD=2.4V
"HIGH" OUTPUT CURRENT IOH [mA]
2.0
18
45 40 35 30 25 20 15 10 5 0 0 1 2 3 4 5 6 DRAIN-SOURCE VOLTAGE VDS[V] VDD=6.0V VDD=4.8V VDD=8.0V BD5342G/FVE
1.0
0.5
0.0 0 1 2 3 4 5 6 7 8 9 10 VDD SUPPLY VOLTAGE VDD[V]
0.5
1.0
1.5
2.0
2.5
DRAIN-SOURCE VOLTAGE VDS[V]
Fig.3 Circuit Current
Fig.4 "Low" Output Current
Fig.5 "High" Output Current
9 OUTPUT VOLTAGE VOUT [V] OUTPUT VOLTAGE VOUT [V] 8 7 6 5 4 3 2 1 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
1.0 CT OUTPUT CURRENT ICT [A] BD5242G/FVE 0.8 0.6 0.4 0.2 0.0 0.0 BD5242G/FVE
450 400 350 300 250 200 150 100 50 0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 VDD SUPPLY VOLTAGE VDD[V] VDD SUPPLY VOLTAGE VDD[V] BD5242G/FVE
Ta=25
Ta=25
VDD SUPPLY VOLTAGE VDD[V]
Fig.6 I/O Characteristics
Fig.7 Operating Limit Voltage
Fig.8 CT Terminal Current
DETECTION VOLTAGE VDET[V]
5.0 Low to high(VDET+VDET) 4.6 4.2 3.8 3.4 3.0 -40 High to low(VDET)
1.0
CIRCUIT CURRENT WHEN OFF I DD2 [A]
BD5242G/FVE
CIRCUIT CURRENT WHEN ON IDD1 [A]
5.4
1.5 BD5242G/FVE
1.5 BD5242G/FVE
1.0
0.5
0.5
0
40
80
0.0 -40 -20
0
20
40
60
80
100
0.0 -40 -20
0
20
40
60
80
100
TEMPERATURE Ta[]
TEMPERATURE Ta[]
TEMPERATURE Ta[]
Fig.9 Detection Voltage Release Voltage
1.5
MINIMUM OPERATING VOLTAGE VOPL[V]
Fig.10 Circuit Current when ON
Fig.11 Circuit Current when OFF
RESISTANCE OF CT RCT [M]
BD5242G/FVE
1.0
0.5
0.0 -40 -20
0
20
40
60
80
100
13 12 11 10 9 8 7 6 5 4 3 2 1 0 -40 -20
10000 BD5242G/FVE DELAY TIME TPLH [ms] 1000 100 10 1 0.1 0.01 BD5242G/FVE
0
20
40
60
80
100
0.001 0.0001
0.001
0.01
0.1
TEMPERATURE Ta[]
TEMPERATURE Ta[]
CAPACITANCE OF CT CCT[F]
Fig.12 Operating Limit Voltage
Fig.13 Ct Terminal Circuit Resistance
Fig.14 Delay Time (TPLH) and CT Terminal External Capacitance
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4/9
2009.06 - Rev.B
BD52G, BD52FVE, BD53G, BD53FVE series
Technical Note
Setting of Detector Delay Time This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal. Delay time at the rise of VDD TPLHTime until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release voltage(VDET+VDET) TPLH = -CCTxRCTxln CCT: VCTH: VDD-VCTH VDD CT pin Externally Attached Capacitance CT pin Threshold VoltageP.2 VCTH refer. RCT : CT pin Internal Impedance P.2 RCT refer. Ln : Natural Logarithm
Reference Data of Falling Time (TPHL) Output Examples of Falling Time (TPHL) Output Part Number tPHL[s] -40C tPHL[s] ,+25C tPHL[s],+105C BD5227G 30.8 30 28.8 BD5327G 26.8 26 24.8 *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. Explanation of Operation For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal voltage switches from either "High" to "Low" or from "Low" to "High". Because the BD52G/FVE series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output "High" voltage (VOUT) in this case becomes VDD or the voltage of the other power supply].
VDD VDD R1 Vref VOUT R2 Q3 R3 GND CT GND CT R3 Q1 R2 Q3 Q1 RL RESET Vref VDD R1 VDD RESET VOUT Q2
Fig.15 (BD52Type Internal Block Diagram)
Fig.16 (BD53Type Internal Block Diagram)
Timing Waveforms Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Fig.15 and 16). 1 When the power supply is turned on, the output is unsettled from VDD after over the operating limit voltage (VOPL) until TPHL. There fore it is possible that the reset signal is not outputted when the rise time of VDET+VDET VDET VDD is faster than TPHL. 2 When VDD is greater than VOPL but less than the reset release VOPL 0V voltage (VDET+VDET), the CT terminal (VCT) and output (VOUT) voltages will switch to L. VCT 3 If VDD exceeds the reset release voltage (VDET+VDET), then 1/2 VDD VOUT switches from L to H (with a delay to the CT terminal). 4 If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to L (with a delay of TPHL). VOUT TPLH TPHL TPLH 5 The potential difference between the detection voltage and the TPHL release voltage is known as the hysteresis width (VDET). The system is designed such that the output does not flip-flop with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise. Fig.17
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5/9
2009.06 - Rev.B
BD52G, BD52FVE, BD53G, BD53FVE series
Circuit Applications 1) Examples of a common power supply detection reset circuit
Technical Note
VDD1 RL BD52 CT CL
Noise-filtering Capacitor
VDD2
Application examples of BD52G/FVE series (Open Drain output type) and BD53G/FVE series (CMOS output type) are shown below.
Microcontroller
GND
Fig.18 Open Collector Output Type
CASE1: the power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use the open drain output type (BD52G/FVE) attached a load resistance (RL) between the output and VDD2. (As shown Fig.15)
VDD1
CASE2: the power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use CMOS output type (BD53G/FVE) or open drain output type (BD52G/FVE) attached a load resistance (RL) between the output and Vdd1. (As shown Fig.16)
BD53 CT CL
Noise-filtering Capacitor
Microcontroller
When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT).
GND
Fig.19 CMOS Output Type 2) The following is an example of a circuit application in which an OR connection between two types of detection voltages resets the microcontroller. VDD1 VDD2 VDD3
RL
BD52 NO.1 CT CT
BD52 NO.2
RST
microcontroller
GND Fig.20
When there are many power supplies of the system, power supplies VDD1 and VDD2 are being monitored separately, and it is necessary to reset the microcomputer, it is possible to use an OR connection on the open drain output type BD52G/FVE series to pull-up to the desired voltage (VDD3) as shown in Fig.17 and make the output "High" voltage matches the power supply voltage VDD3 of the microcontroller.
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6/9
2009.06 - Rev.B
BD52G, BD52FVE, BD53G, BD53FVE series
Technical Note
3) Examples of the power supply with resistor dividers In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output oscillatory state). (Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level switches from "High" to "Low" or vice versa.)
V1
IDD
R2 I1 VDD
Through Current
R1
CIN
BD52 BD53 CL GND
VOUT
VDD 0 Fig.21 VDET
A voltage drop of [the through-current (I1)] x [input resistor (R2)] is caused by the through current, and the input voltage to descends, when the output switches from "Low" to "High". When the input voltage decreases and falls below the detection voltage, the output voltage switches from "High" to "Low". At this time, the through-current stops flowing through output "Low", and the voltage drop is eliminated. As a result, the output switches from "Low" to "High", which again causes the through current to flow and the voltage drop. This process is repeated, resulting in oscillation.
VDD - IDD Peak Current Ta=25C 10 BU43xx BU42xx BD52xx BD53xx
Temp - IDD(BD52xx) 0.4
VDD3V VDD5V VDD7V VDD10V
0.1
IDD peak current [mA]
3 4 5 6 7 VDD[V] 8 9 10
1 IDD-peak[mA]
0.3
0.2
0.01
0.1
0.001
0 -50
-30
-10
10
30 50 Temp[C]
70
90
110
130
Fig.22 Current Consumption vs. Power Supply Voltage *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use.
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7/9
2009.06 - Rev.B
BD52G, BD52FVE, BD53G, BD53FVE series
Technical Note
Operation Notes 1 . Absolute maximum range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2 . GND potential GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if, include transient feature. 3 . Electrical Characteristics Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4 . Bypass Capacitor for Noise Rejection Please put into the capacitor of 1F or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5 . Short Circuit between Terminal and Soldering Don't short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6 . Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7. 8. 9. 10. The VDD line inpedance might cause oscillation because of the detection current. A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance. If 10M leakage is assumed between the CT terminal and the GND terminal, 1M connection between the CT terminal and the VDD terminal would be recommended. The value of RCT depends on the external resistor that is connected to CT terminal, so please consider the delay time that is decided by xRCTxCCT changes.
11. External parameters The recommended parameter range for CT is 100pF~0.1F and RL is 50k~1M. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 12. Power on reset operation Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation. 13. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered.
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8/9
2009.06 - Rev.B
BD52G, BD52FVE, BD53G, BD53FVE series
Part Number Selection
Technical Note
B
D
5
2
2
3
G
T
R
BD52: Adjustable Delay Time CMOS Reset IC Open Drain Type BD53: Adjustable Delay Time CMOS Reset IC CMOS Output Type
Reset Voltage Value 23: 2.3V to (0.1V step) 60: 6.0V
Package G: SSOP5 FVE: VSOF5
Taping Specifications Embossed Taping
SSOP5
2.90.2
5 4
+6 4 -4

Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR
The direction is the 1pin of product is at the upper right when you hold
+0.2 1.6 -0.1
2.80.2
1
2
3
0.2Min.
( reel on the left hand and you pull out the tape on the right hand
1pin
)
+0.05 0.13 -0.03
1.25Max.
1.10.05
0.050.05
+0.05 0.42 -0.04 0.95 0.1
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
VSOF5
0.2MAX
1.60.05 1.00.05
5 4

Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR
The direction is the 1pin of product is at the upper right when you hold
(MAX 1.28 include BURR)
1.6 0.05
1.2 0.05
( reel on the left hand and you pull out the tape on the right hand
1pin
)
1
2
3
0.130.05
0.6MAX
0.5
0.220.05
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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9/9
2009.06 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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